Communicating Innovation in Distributed Semiconductor Design Platforms

Abstract

The increasing complexity of semiconductor systems and the global distribution of design teams have intensified the need for effective communication within distributed semiconductor design platforms. This study investigates how communication practices influence innovation outcomes in such environments by conceptualizing communication as a multidimensional construct encompassing clarity, frequency, integration, and transparency. Using a mixed-methods research design, the study combines survey-based quantitative analysis with qualitative insights from practitioners involved in distributed semiconductor design projects. Empirical results demonstrate that communication maturity has a significant positive effect on innovation performance, with communication integration emerging as the strongest predictor of design efficiency, quality improvement, rework reduction, and innovation throughput. Visual and statistical analyses further reveal that structurally embedded and transparent communication mechanisms outperform ad-hoc interaction models in sustaining innovation velocity. The findings highlight communication as a strategic capability rather than a support function and offer practical guidance for designing communication-aware distributed platforms that enhance innovation in semiconductor ecosystems.