Yield Analysis in Semiconductor Manufacturing: Techniques, Case Studies, and Future Direction

Abstract

Introduction: This paper aims to provide a comprehensive overview of yield analysis techniques, applications, and future directions in semiconductor manufacturing, highlighting their significance in improving productivity, quality, and competitiveness.

Objective: The scope of this paper includes Techniques Line yield, Die yield, Pareto yield, Functional yield, Parametric yield, Wafer Sort, Fishbone Diagrams, Scatter Plot, Regression Analysis, and Fault Tree Analysis.

Methods: The paper mainly focused on the examination of yield analysis in semiconductor manufacturing, including defect reduction, process optimization, and product quality improvement.

Result: The comprehensive analysis gives an in-depth analysis of yield analysis techniques strengths, weaknesses, opportunities, and threats (SWOT analysis) and their applications. Conclusion: Future Research Directions are opportunities for improving yield analysis techniques and their applications.